![SMART_DDR4_MIP](https://www.smartm.com/upload/images/2021/06-22/e4a2f2eab68a4ef49421035cc8f8a78f.jpg_1.jpg)
DDR4 MIP™ (Module-in-a-Package™)
DDR4
SMART's MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications, such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
- Essentials
- DDR4
- MIP
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
512Mx16
1Gx8
1Gx16
2Gx16 - 256Mb
512Mb
1Gb
2Gb - x64
- 1.2V
- 216-Pin
- Performance
- 2GB
4GB
8GB
16GB - 2933MT/s
3200MT/s - PC4-23400
PC4-25600 - CL = 21
CL = 22
- Environmental
- Yes
- Physical
- 22.25mm
SMART Special DIMM Type Brochure_2024 | 07/04/2024 |
SMART DRAM for IIoT Applications | 06/26/2024 |
SMART MIP (Module-in-a-Package)_Product Brief | 06/26/2024 |
SMART Industrial Memory_Product Brief | 07/02/2024 |
SMART DDR4_Product Brief | 06/26/2024 |