DDR3 MIP™ (Module-in-a-Package™)

DDR3

SMART’s MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.

Essentials
DDR3
MIP
C-temp: 0˚C to 70˚C
256Mx16
256Mb
x64
1.35V
216-Pin
Performance
2GB
1866MT/s
PC3-14900
CL = 13
Environmental
Yes
Physical
22.25mm
SP2566MP321638NE2GBC-temp (0˚C to +70˚C)