BGAE240 MLC | eMMC | 153-ball/100-ball

eMMC

SMART’s BGAE240 eMMC is an embedded memory solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage.

SMART’s BGAE240 eMMC solution is available in the standard JEDEC 0.5mm pitch, 153-ball package, as well as an eMMC interposer module which has a footprint and pin-out compatible with the JEDEC Standard 1.0mm pitch, 100-ball package. The 100-ball package offers a solution with large ball pitch and ball diameter which enables lower cost PCB designs, simplifies PCB routing with wider metal traces, resulting in better thermal dissipation.

Explore our full range of eMMC products: https://smartsemi.com/products-flash/