BGAE240 MLC | eMMC | 153-ball/100-ball
eMMC
SMART Modular世邁科技DuraFlash BGAE240 eMMC系列產品是一款採用小型BGA封裝的嵌入式記憶體方案，搭載NAND快閃記憶體、嵌入式MMC控制器及高階韌體，提供穩定且具成本效益的高容量嵌入式儲存，專為滿足工業、醫療和網通應用嚴苛的需求所設計。
SMART Modular世邁科技DuraFlash BGAE240符合eMMC v5.0規範及JEDEC 0.5mm pitch 153-ball BGA封裝與1.0mm pitch 100-ball BGA封裝。100-ball eMMC模組提供較大的ball pitch與直徑，一方面可降低 PCB板設計成本，另一方面透過較寬的金屬走線來簡化PCB板佈線，提供更佳的散熱效果。
- 標準
- BGAE240
- MLC
- eMMC v5.0
- 153 ball
100 ball
- 效能
- Up to 260MB/s
- Up to 130MB/s
- Up to 6K IOPS
- Up to 2.2K IOPS
- 8GB
16GB
32GB
- 可靠度
- 8GB: 10 TBW
16GB: 24 TBW
32GB: 56 TBW
(Sequential Workload)
- 環境耐受度
- 1500G half-sine, 0.5 msec, 1 shock along each axis, X, Y, Z in each direction
- 20G 80-2000Hz, 1.52mm 20-80Hz, 3 axis
- W-temp: -40℃ to +105℃
- -40℃ to +105℃
- 40℃, Operation: 90% RH, Storage: 93% RH
- 尺寸
- 11.5mm (153 ball)
14mm (100 ball) - 13mm (153 ball)
18mm (100 ball) - 1mm (153 ball)
2.45mm (100 ball)
| SMART BGAE240 eMMC_Product Brief | 07/04/2024 |
| SMART eMMC_Case Study | 07/04/2024 |
| SMART Flash Storage Product Brochure_2024 | 07/04/2024 |